Integrated display, lens, camera, and light source.
Embedded system using PGA+ARM architecture. Linux 3.10 operating system. 1/2-inch backlit CMOS sensor.
Dual-core Cortex-A9 image processor. High-speed image acquisition of up to 2 million pixels, with a resolution of 1920x1080 @ 60fps.
USB interface for connecting to a wireless mouse and USB flash drive.
CCD with built-in measurement software.
Software includes an image stacking function. Images and data can be transferred to a computer via the Internet.
3D side prism for real-time 360-degree side observation.
※Briefly describe product features; other specifications are subject to actual shipment per customer requirements※
Integrated Design | Real-time 360° Side Observation | Embedded High-Efficiency Imaging Platform
The RV-smart 3D Depth-of-Field Micro 2D features a fully integrated display, lens, camera, and light source, combined with an embedded high-speed processing architecture to achieve real-time high-resolution image acquisition and intelligent measurement. Its 3D side prism design enables real-time 360° side observation, significantly enhancing inspection flexibility and depth. With built-in comprehensive measurement software and image stacking capabilities, it is suitable for demanding applications in electronics, precision machinery, and materials science. Core Technology Advantages
▌Fully Integrated Hardware Architecture
The integrated design of the screen, lens, camera, and light source enables quick installation and easy operation.
Using a 1/2-inch back-illuminated CMOS sensor, it captures clear details and is suitable for low-light environments.
3D side prism module enables 360° side viewing.
▌Efficient Embedded Image Processing
Equipped with a dual-core Cortex-A9 processor, it supports real-time image processing.
Utilizing a PGA + ARM architecture and running the Linux 3.10 operating system, it offers both stability and scalability.
Image capture reaches 1920×1080 @ 60fps, supporting high-speed, high-resolution inspection.
▌Intelligent Operation and Data Management
Built-in measurement software supports geometric measurement, dimensional analysis, and image processing.
New image stacking function clearly restores microscopic 3D details.
USB support An external mouse and USB drive are available for easy operation and data storage. Images and measurement data can be instantly transferred to a computer via a network interface for further analysis and recording. Typical Applications: Microstructure observation and dimensional measurement (IC packaging, PCB, MEMS); Materials R&D and failure analysis (surface cracks, pitting, thin film inspection); Precision manufacturing and quality control inspection (screws, springs, metal stampings).